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Why does the pc board processing endurance board crack?

by:UNQ     2021-03-13

   The phenomenon of stress cracking in the endurance board processed by pc board is mainly determined by the structure and performance of the material of the endurance board. When co-extrusion molding endurance board, the molecular chain will be forced to align, and because the polycarbonate molecular chain has a benzene ring, de-orientation will become more difficult. Therefore, after forming, the oriented chain may still return to its natural state, but because the entire molecular chain has been frozen and the macromolecular chain is about each other, there will be residual stress in the product, resulting in the appearance of endurance board products. The possibility of stress cracking.

   This is not absolute, because there are many different forces inside polycarbonate, such as crack resistance. The length of the molecular chain, the number of entanglements between the chains, and the force between molecules are all the key factors that determine the magnitude of this force chain. Therefore, as long as we ensure that the anti-cracking ability and the internal stress reach a balance, the cracking phenomenon of the endurance board will not occur.

   Endurance board is a kind of building material with very good performance, which can be used for heat insulation, sound insulation and so on. However, when we actually use it, we will find that the endurance board is prone to stress cracking. It is to increase the mold temperature of the endurance board, because the higher the mold temperature, the easier the molecular chain can move, which is beneficial to the orientation in the polycarbonate. Molecular relaxation. After testing, the temperature of the endurance board mold is controlled at about 100 to 120 degrees.

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